Materials in normal

BASE MATERIALS

Item Spec
Polyimide ½mil, 1mil, 2mil, 3mil. 4mil. 5mil. 6mil
Copper 3㎛, 9㎛, 18㎛, 35㎛, 70㎛, 107㎛

SOLDER MASK MATERIALS

Item Spec
Polyimide COV ½mil, 1mil, 2mil, 3mil, 4mil, 5mil, 7mil, 9MIL
Photo-imaging YELLOW, BLACK, WHITE, GREEN, BLUE, RED

PREPREG[NO FLOW] MATERIALS

Item Spec
TG 170 celcius 45㎛, 75㎛
TG 160 celcius 25㎛, 40㎛, 60㎛, 80㎛, 110㎛

BONDING SHEET MATERIALS

Item Spec
BONDING 12.5㎛, 25㎛, 35㎛, 50㎛
Thermo-hardening adhesive 25㎛, 35㎛, 150㎛

STIFFNER MATERIALS

Item Spec
Polyimide ½mil, 1mil, 2mil, 3mil, 4mil, 5mil, 7mil, 9MIL
EPOXY 0.1T~1.6T
SUS 0.1T~0.4T
OTHER Aluminum, CU

PEN MATERIALS

Item Spec
PEN FILM 2MIL
Copper 18㎛, 35㎛
PEN COVERLAY 2MIL (ADH 50㎛)

DOUBLE TAPE MATERIALS

  • Min. 10 ㎛ ~ Max. 200 ㎛

OTHER MATERIALS

  • EMI FILM
  • PI FILM
  • ECO BOND
  • Not listed items could be discussed with customers

SILK MATERIALS

  • IR TYPE
  • COLOR : WHITE, BLACK

SURFACE MATERIALS

Item Normal Max
ENIG Ni. 3-7㎛ Au.Min 0.03㎛ Max. 0.08㎛
ENEPIG Ni. 6-12 Pd.0.08-0.2㎛ Au.Min 0.1㎛
High ductility Au surface treating Ni. 1-3㎛ Au.Min 0.03㎛ MIN. 15㎛
TIN Plating Min 0.4~0.6㎛ MIN. 0.65㎛
SnCu Min 2㎛ MAX. 30㎛
SOFT GOLD Ni. 5-15㎛ Au.Min 0.5㎛ MAX. 0.8㎛
SILVER Normal 0.1㎛ -
ELEC HARD GOLD Ni. 3㎛ ~ Au. Min 0.1㎛ Customer SPEC
DIRECT GOLD Min 0.8㎛ -
OSP MIN 0.3㎛ -