Materials in normal
BASE MATERIALS
Item | Spec |
---|---|
Polyimide | ½mil, 1mil, 2mil, 3mil. 4mil. 5mil. 6mil |
Copper | 3㎛, 9㎛, 18㎛, 35㎛, 70㎛, 107㎛ |
SOLDER MASK MATERIALS
Item | Spec |
---|---|
Polyimide COV | ½mil, 1mil, 2mil, 3mil, 4mil, 5mil, 7mil, 9MIL |
Photo-imaging | YELLOW, BLACK, WHITE, GREEN, BLUE, RED |
PREPREG[NO FLOW] MATERIALS
Item | Spec |
---|---|
TG 170 celcius | 45㎛, 75㎛ |
TG 160 celcius | 25㎛, 40㎛, 60㎛, 80㎛, 110㎛ |
BONDING SHEET MATERIALS
Item | Spec |
---|---|
BONDING | 12.5㎛, 25㎛, 35㎛, 50㎛ |
Thermo-hardening adhesive | 25㎛, 35㎛, 150㎛ |
STIFFNER MATERIALS
Item | Spec |
---|---|
Polyimide | ½mil, 1mil, 2mil, 3mil, 4mil, 5mil, 7mil, 9MIL |
EPOXY | 0.1T~1.6T |
SUS | 0.1T~0.4T |
OTHER | Aluminum, CU |
PEN MATERIALS
Item | Spec |
---|---|
PEN FILM | 2MIL |
Copper | 18㎛, 35㎛ |
PEN COVERLAY | 2MIL (ADH 50㎛) |
DOUBLE TAPE MATERIALS
OTHER MATERIALS
SILK MATERIALS
SURFACE MATERIALS
Item | Normal | Max |
---|---|---|
ENIG | Ni. 3-7㎛ Au.Min 0.03㎛ | Max. 0.08㎛ |
ENEPIG | Ni. 6-12 Pd.0.08-0.2㎛ Au.Min 0.1㎛ | |
High ductility Au surface treating | Ni. 1-3㎛ Au.Min 0.03㎛ | MIN. 15㎛ |
TIN Plating | Min 0.4~0.6㎛ | MIN. 0.65㎛ |
SnCu | Min 2㎛ | MAX. 30㎛ |
SOFT GOLD | Ni. 5-15㎛ Au.Min 0.5㎛ | MAX. 0.8㎛ |
SILVER | Normal 0.1㎛ | - |
ELEC HARD GOLD | Ni. 3㎛ ~ Au. Min 0.1㎛ | Customer SPEC |
DIRECT GOLD | Min 0.8㎛ | - |
OSP | MIN 0.3㎛ | - |