MANUFACTURING capability

We Specialze In FPC/R-FPC Manufacturing
And Quick Turn Prototype Fabrication :

Looking for FPC/R-FPC Manufacturers? Look no further, JinSung provides high quality Korea made quick turn PCB Manufacturing. We understand how important it is to our customers that we deliver their FPC/R-FPC’s on time, so they can launch their product faster and more efficiently.

As a leading FPC/R-FPC supplier, we have diverse capabilities for any type of FPC/R-FPC Fabrication challenge that you can throw at us. We have over twenty-five years of experience providing simple and full prototype FPC/R-FPC for thousands of businesses around the world. No MOQ or NRE requirements to customer, and this provides your company with more flexibility and options for your FPC/R-FPC fabrication specifications. Only set-up charge about $300~$500 is required at sample production, and this set-up charge is going to be returned to you when PO for mass production is released.Do you need a high quality FPC/R-FPC prototype and mass production with quick turnaround? Get a custom quote by going to Request Custom Quote.

Below is a list of JinSung Electronics manufacturing capabilities.
All PCB files should be sent in a zip-format and sending a readme file is recommended.

Product range for manufacturing

  • Single-Side
  • Double-Side
  • Multi-Layer[3layer~20layer]
  • Rigid-Flexible[3layer~20layer]
  • Build-up Circuits (HDI)
  • Class 1,2,3

WORKING SIZE

  • X. 250mm OR 500mm
  • Y. Max 700mm

Via Drill

Item Min. Spec Tolerance[㎛]
Machine Double Min . 0.1mm +-30㎛
MLB[BVH] Min. 0.15mm +-30㎛
SLOT HOLE
[Min. 0.4Φ]
SPEC (A≥2B)
Machine Double Min . 0.075mm +-15㎛
MLB[BVH] Min . 0.01mm +-15㎛

Via Drill/Land

Item Spec Remarks
PTH HOLE
VIA LAND SIZE 0.08Φ=>0.25mm Double
0.15Φ=>0.30mm 3L~
0.2Φ=>0.4mm 3L~6L
0.25Φ=>0.5mm 7LAYER~
HOLE~PATT Min 0.15mm Edge part
HOLE~OUTLINE Min 0.3mm
(NPTH)
Laser Drill
VIA LAND SIZE 0.012Φ=>0.3mm
0.15Φ=>0.35mm
DEPTH [MAX80㎛]

Pattern

Item Line/Space [㎛]
Single side MIN. 45/45
Double side MIN. 50/50
MLB MIN. 60/60
Remarks Line/Space could be variable depend on copper thickness(CU)

Impedance

Possible to support simulation function when customer want

  • Coated Microstrip
  • Offset Stripline
  • Surface Microstrip
  • Edge-coupled Coated Microstrip
  • Edge-Coupled Offset Stripline
  • Edge-coupled Surface Microstrip

Cu-plating [PTH IPC 6013]

Copper – average2,3 Class 1 Class 2 Class 3
Type 2 12㎛ [472µin] 12㎛ [472µin] 12㎛ [472µin]
Type 3 and Type except as noted below 25㎛ [984µin] 25㎛ [984µin] 25㎛ [984µin]
Type 3 and Type 4 greater than 1.5 mm [0.059 in) thickness and has low TG materials less than 110 °C in the areas of the board spanned by PTHs 35㎛ [1378µin] 35㎛ [1378µin] 35㎛ [1378µin]
Minimum Wrap4 AABUS 5㎛ [197µin] 12㎛ [472µin]
Copper (Min.Thin Areas) Class 1 Class 2 Class 3
Type 2 10㎛ [394µin]] 10㎛ [394µin]] 10㎛ [394µin]]
Type 3 and Type except as noted below 20㎛ [787µin] 20㎛ [787µin] 20㎛ [787µin]
Type 3 and Type 4 greater than 1.5 mm [0.059 in) thickness and has low TG materials less than 110 °C in the areas of the board spanned by PTHs 30㎛ [1181µin] 30㎛ [1181µin] 30㎛ [1181µin]
Minimum Wrap4 AABUS 5㎛ [197µin] 12㎛ [472µin]

VIA FILL - Plating

  • DEPTH MAX 80%
  • BOARD THICKNESS : Max.1.6t
  • LASER VIA Min 0.1mm

Cu-plating [Buried via Plating IPC-6013]

Surface and Hole Copper Minimum Requirements for Buried Vias > 2 Layers, and Blind Vias1

Item Class 1 Class 2 Class 3
Copper – average2,4 20㎛ [787µin] 20㎛ [787µin] 25㎛ [984µin]]
Thin areas4 18㎛ [709µin] 18㎛ [709µin] 20㎛ [787µin]

Surface and Hole Copper Minimum Requirements for Microvias (Blind and Buried)1

Item Class 1 Class 2 Class 3
Copper – average2,4 12㎛ [472µin] 12㎛ [472µin] 12㎛ [472µin]
Thin areas4 10㎛ [394µin] 10㎛ [394µin] 10㎛ [394µin]

Surface and Hole Copper Plating Minimum Requirements for Buried via Cores (2 Layers)

Item Class 1 Class 2 Class 3
Copper – average1,3 13㎛ [512µin] 15㎛ [592µin] 15㎛ [592µin]
Thin areas3 11㎛ [433µin] 13㎛ [512µin] 13㎛ [512µin]

Alignment

Item SPEC Tolerance[㎛]
Coverlay Min 0.1mm +- 100㎛
Photo-imageable Min 0.05mm +- 50㎛

COVERLAY specification

Item Design Specification
TOOL   Example SPEC
MIN SPACE - Min 0.25mm
MIN. Open size - Min 0.5*0.5mm
Corner Round Apply Round 0.2MM
LAND TO MASK LAND OPEN - Min 0.1mm
MIN SPACE - Min 0.1mm
RESINE FLOW Opened copper terminal Max 0.15mm
Under 1005chip - Open coverlay

PSR specification

Item Design Specification
Normal PSR   Example SPEC
S/M OPEN
Min 0.05mm
PSR DAM
Min 0.075mm
PSR INK 25+-5㎛
BGA S/M OPEN BGA Land + 0.06mm
PSR DAM Min 0.05mm
PAD ON MASK Min 0.3mm

Tooling

Item Apply to Tolerance[㎛]
ROUTER CUT RIGID ± 100㎛
STEEL CUT FLEXIBLE ± 50㎛
LASER CUT FLEXIBLE ± 30㎛

Routing

Steel

Item SPEC Remarks
Hole TO PATT Min 0.15mm
HOLE TO OUTLINE Min 0.3mm
OUTLINE TO PATT D/S Min 0.15mm
Multi Layer Min 0.2mm
HOLE TO HOLE Normal :± 0.2MM
SPECIAL:± 0.1MM
Tolerance Normal :± 0.1MM
SPECIAL:± 0.05MM

Others