MANUFACTURING capability
We Specialze In FPC/R-FPC Manufacturing
And Quick Turn Prototype Fabrication :
Looking for FPC/R-FPC Manufacturers? Look no further, JinSung provides high quality Korea made quick turn PCB Manufacturing. We understand how important it is to our customers that we deliver their FPC/R-FPC’s on time, so they can launch their product faster and more efficiently.
As a leading FPC/R-FPC supplier, we have diverse capabilities for any type of FPC/R-FPC Fabrication challenge that you can throw at us. We have over twenty-five years of experience providing simple and full prototype FPC/R-FPC for thousands of businesses around the world. No MOQ or NRE requirements to customer, and this provides your company with more flexibility and options for your FPC/R-FPC fabrication specifications. Only set-up charge about $300~$500 is required at sample production, and this set-up charge is going to be returned to you when PO for mass production is released.Do you need a high quality FPC/R-FPC prototype and mass production with quick turnaround? Get a custom quote by going to Request Custom Quote.
Below is a list of JinSung Electronics manufacturing capabilities.
All PCB files should be sent in a zip-format and sending a readme file is recommended.
Product range for manufacturing
WORKING SIZE
Via Drill
| Item | Min. Spec | Tolerance[㎛] | |
|---|---|---|---|
| Machine | Double | Min . 0.1mm | +-30㎛ |
| MLB[BVH] | Min. 0.15mm | +-30㎛ | |
| SLOT HOLE [Min. 0.4Φ] |
SPEC (A≥2B)
|
||
| Machine | Double | Min . 0.075mm | +-15㎛ |
| MLB[BVH] | Min . 0.01mm | +-15㎛ | |
Via Drill/Land
| Item | Spec | Remarks | |
|---|---|---|---|
PTH HOLE
|
VIA LAND SIZE | 0.08Φ=>0.25mm | Double |
| 0.15Φ=>0.30mm | 3L~ | ||
| 0.2Φ=>0.4mm | 3L~6L | ||
| 0.25Φ=>0.5mm | 7LAYER~ | ||
| HOLE~PATT | Min 0.15mm | Edge part | |
| HOLE~OUTLINE | Min 0.3mm |
|
|
Laser Drill
|
VIA LAND SIZE | 0.012Φ=>0.3mm 0.15Φ=>0.35mm |
DEPTH [MAX80㎛] |
Pattern
| Item | Line/Space [㎛] |
|---|---|
| Single side | MIN. 45/45 |
| Double side | MIN. 50/50 |
| MLB | MIN. 60/60 |
| Remarks | Line/Space could be variable depend on copper thickness(CU) |
Impedance
Possible to support simulation function when customer want
-
Coated Microstrip -
Offset Stripline -
Surface Microstrip -
Edge-coupled Coated Microstrip -
Edge-Coupled Offset Stripline -
Edge-coupled Surface Microstrip
Cu-plating [PTH IPC 6013]
| Copper – average2,3 | Class 1 | Class 2 | Class 3 |
|---|---|---|---|
| Type 2 | 12㎛ [472µin] | 12㎛ [472µin] | 12㎛ [472µin] |
| Type 3 and Type except as noted below | 25㎛ [984µin] | 25㎛ [984µin] | 25㎛ [984µin] |
| Type 3 and Type 4 greater than 1.5 mm [0.059 in) thickness and has low TG materials less than 110 °C in the areas of the board spanned by PTHs | 35㎛ [1378µin] | 35㎛ [1378µin] | 35㎛ [1378µin] |
| Minimum Wrap4 | AABUS | 5㎛ [197µin] | 12㎛ [472µin] |
| Copper (Min.Thin Areas) | Class 1 | Class 2 | Class 3 |
|---|---|---|---|
| Type 2 | 10㎛ [394µin]] | 10㎛ [394µin]] | 10㎛ [394µin]] |
| Type 3 and Type except as noted below | 20㎛ [787µin] | 20㎛ [787µin] | 20㎛ [787µin] |
| Type 3 and Type 4 greater than 1.5 mm [0.059 in) thickness and has low TG materials less than 110 °C in the areas of the board spanned by PTHs | 30㎛ [1181µin] | 30㎛ [1181µin] | 30㎛ [1181µin] |
| Minimum Wrap4 | AABUS | 5㎛ [197µin] | 12㎛ [472µin] |
VIA FILL - Plating
Cu-plating [Buried via Plating IPC-6013]
Surface and Hole Copper Minimum Requirements for Buried Vias > 2 Layers, and Blind Vias1
| Item | Class 1 | Class 2 | Class 3 |
|---|---|---|---|
| Copper – average2,4 | 20㎛ [787µin] | 20㎛ [787µin] | 25㎛ [984µin]] |
| Thin areas4 | 18㎛ [709µin] | 18㎛ [709µin] | 20㎛ [787µin] |
Surface and Hole Copper Minimum Requirements for Microvias (Blind and Buried)1
| Item | Class 1 | Class 2 | Class 3 |
|---|---|---|---|
| Copper – average2,4 | 12㎛ [472µin] | 12㎛ [472µin] | 12㎛ [472µin] |
| Thin areas4 | 10㎛ [394µin] | 10㎛ [394µin] | 10㎛ [394µin] |
Surface and Hole Copper Plating Minimum Requirements for Buried via Cores (2 Layers)
| Item | Class 1 | Class 2 | Class 3 |
|---|---|---|---|
| Copper – average1,3 | 13㎛ [512µin] | 15㎛ [592µin] | 15㎛ [592µin] |
| Thin areas3 | 11㎛ [433µin] | 13㎛ [512µin] | 13㎛ [512µin] |
Alignment
| Item | SPEC | Tolerance[㎛] |
|---|---|---|
| Coverlay | Min 0.1mm | +- 100㎛ |
| Photo-imageable | Min 0.05mm | +- 50㎛ |
COVERLAY specification
| Item | Design Specification | ||
|---|---|---|---|
| TOOL | Example | SPEC | |
| MIN SPACE | - | Min 0.25mm | |
| MIN. Open size | - | Min 0.5*0.5mm | |
| Corner Round | Apply Round 0.2MM | ||
| LAND TO MASK | LAND OPEN | - | Min 0.1mm |
| MIN SPACE | - | Min 0.1mm | |
| RESINE FLOW | Opened copper terminal | Max 0.15mm | |
| Under 1005chip | - | Open coverlay | |
PSR specification
| Item | Design Specification | ||
|---|---|---|---|
| Normal PSR | Example | SPEC | |
| S/M OPEN |
|
Min 0.05mm | |
| PSR DAM |
|
Min 0.075mm | |
| PSR INK | 25+-5㎛ | ||
| BGA | S/M OPEN | BGA Land + 0.06mm |
|
| PSR DAM | Min 0.05mm | ||
| PAD ON MASK Min 0.3mm | |||
Tooling
| Item | Apply to | Tolerance[㎛] |
|---|---|---|
| ROUTER CUT | RIGID | ± 100㎛ |
| STEEL CUT | FLEXIBLE | ± 50㎛ |
| LASER CUT | FLEXIBLE | ± 30㎛ |
Routing
Steel
| Item | SPEC | Remarks |
|---|---|---|
| Hole TO PATT | Min 0.15mm |
|
| HOLE TO OUTLINE | Min 0.3mm |
|
| OUTLINE TO PATT | D/S Min 0.15mm Multi Layer Min 0.2mm |
|
| HOLE TO HOLE | Normal :± 0.2MM SPECIAL:± 0.1MM |
|
| Tolerance | Normal :± 0.1MM SPECIAL:± 0.05MM |
|
Others
