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이메일
사이트맵
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기술능력
Category Current Near Term for 1~3 years
Laminate

FR-4, FR-5, BT, 
Polymide,
Teflon

Glass-free Epoxy/ BT, 
PPE,Aramid, 
Cyanate Ester, Ceramic

Package

P-BGA(OMPAC TYPE)
MCM-BGA

CP-BGA(E-BGA)

U-BGA/CSP

MCM-IVH
BUM-BGA
DCA
MCM-BUM

MLB

IVH(Buride/Blind Via)

PCMCIA(16mils/6L)

Metal Core

IVH(Buride/Blind Via)

 - Photo/Plasma Via

 - PCMCIA(16mils/8L)
Flex-MLB

PCMCIA(16mils/8L)

SINGLE & DOUBLE SIDE FLEXIBLE
ROAD MAP
- MOBILE PHONE (LCD MODULE, CAMERA MODULE), DEGITAL CAMERA, KEYPAD, BLU -

Min.

LINE / SPACE

40㎛/ 40㎛ Mass Procuction

Min. PTH

VIA / LAND

50㎛/ 250㎛ Mass Procuction
SURFACE FINISH

◈ Electrolytic Ni / Au
◈ Electroless Ni / Au
◈ Immersion Tin
◈ Electrolytic Sn / Pb
◈ Electrolytic Ni / Au (Wire Bonding)
◈ OSP (Pre Flux)
◈ Direct Gold
◈ Immersion Sn / Cu
◈ Immersion Ag / Au
◈ Electrolytic Silver
◈ Electrolytic Silver / Au
◈ ENEPIG(Electroless Nickel Electroless Palldium Innersion Gold)
◈ SPUTTERING Shield Silver Coating

RIGID FLEXIBLE
ROAD MAP
- MOBILE PHONE (LCD, CAMERA MODULE), KEYPAD, DEGITAL CAMERA, COMPUTER -

LAYER

12 LAYER Mass Production

(BVH Inclusion)

Min. INNER LAYER

LINE / SPACE

40㎛ / 40㎛ Mass Production

Min. OUT LAYER

LINE / SPACE

50㎛ / 50㎛ Mass Production

Min. PTH

VIA / LAND

50㎛ / 250㎛ Mass Production

Min. MVH

VIA / LAND

50㎛ / 225㎛ Mass Production
SURFACE FINISH

◈ Electrolytic Ni / Au

◈ Electroless Ni / Au

◈ Immersion Tin

◈ Electrolytic Sn / Pb

◈ Electrolytic Ni / Au (Wire Bonding)

◈ OSP (Pre Flux)

◈ Direct Gold

◈ Immersion Sn / Cu

◈ Immersion Ag / Au

◈ Electrolytic Silver

◈ Electrolytic Silver / Au

◈ ENEPIG

 (Electroless Nickel Electroless Palldium Immersion Gold)
◈ SPUTTERING Shield Silver Coating

MULTI LAYER FLEXIBLE
ROAD MAP
- MOBILE PHONE (LCD, CAMERA MODULE), KEYPAD, DEGITAL CAMERA, COMPUTER -

LAYER

8 LAYER Mass Production

(BVH Inclusion)

Min. INNER LAYER

LINE / SPACE

40㎛ / 40㎛ Mass Production

Min. OUT LAYER

LINE / SPACE

50㎛ / 50㎛ Mass Production

Min. PTH

VIA / LAND

50㎛ / 250㎛ Mass Production

Min. MVH

VIA / LAND

50㎛ / 225㎛ Mass Production
SURFACE FINISH

◈ Electrolytic Ni / Au

◈ Electroless Ni / Au

◈ Immersion Tin

◈ Electrolytic Sn / Pb

◈ Electrolytic Ni / Au (Wire Bonding)

◈ OSP (Pre Flux)

◈ Direct Gold

◈ Immersion Sn / Cu

◈ Immersion Ag / Au

◈ Electrolytic Silver

◈ Electrolytic Silver / Au

◈ ENEPIG

 (Electroless Nickel Electroless Palldium Immersion Gold)
◈ SPUTTERING Shield Silver Coating

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