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PCB 제조능력
Key Functions Current Near Term
Max.Laver for
Figid-Flex
12 Layer 20 Layer
Solder Open Cover Lay Solder Resist Cover Lay Solder Resist
0.4mm 0.3mm 0.3mm 0.2mm
Min.Pattern Width/Space (㎛) 50 / 50 30 / 30
Min.PTH Hole Size (mm)/ PAD Dia. Φ0.15/ 0.25 Φ0.1/ 0.2
Surface Finish Chemical Gold-hard. Chemical Sn Chemical Gold-hard,soft
Elec. Gold-hard&soft Elec.Sn
Remark

Casting type (2 layer) C.C.L

Double Access FPC

PDP, EL Panel FPC

COF (chip on Flex)

 
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